YOUIBOT Leads China’s Semiconductor Logistics Robotics with Full-Chain Smart Solutions
YOUIBOT has become China’s top player in semiconductor logistics robotics, offering full-process automation systems for fabs and packaging plants. With five years of market leadership, its technology powers clients like TSMC and SMIC.

As global semiconductor manufacturers accelerate automation, traditional logistics has become a key bottleneck in the push for smart transformation. Since 2017, YOUIBOT, a leading Chinese mobile robot company, has recognized the urgent need for domestic semiconductor equipment solutions. Leveraging its strong technical foundation in industrial AMRs (autonomous mobile robots), the company made an early strategic move into the semiconductor robotics sector.
Today, YOUIBOT stands as a benchmark enterprise in semiconductor automation logistics in China. Its full-scenario intelligent logistics systems now serve the entire semiconductor value chain—from fabs to packaging and final testing facilities. With industry-leading customization capabilities and robust project delivery, YOUIBOT has maintained the No.1 position in shipment volume and market share for semiconductor logistics robots in China for five consecutive years.
Full-Process Coverage Tackles Core Semiconductor Logistics Challenges
Semiconductor manufacturing demands extreme cleanliness, precision, and stability. Addressing the inefficiencies and contamination risks of manual handling, YOUIBOT’s self-developed OW series wafer-handling robots are purpose-built for semiconductor environments. Designed to integrate seamlessly with EFEM (Equipment Front-End Module), Stockers, and other critical systems, the OW series operates reliably in Class 1 cleanrooms with vibration levels under 0.1g and operational precision within ±1mm—meeting stringent micro-vibration control standards at the wafer level.
YOUIBOT’s automation solutions cover the full spectrum of semiconductor manufacturing, including:
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Front-End Processes: Etching, lithography, coating, oxidation, ion implantation
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Back-End Processes: Die attach, wire bonding, molding, and final testing
The modular system supports various wafer carriers like FOUP, FOSB, and SMIF pods, enabling seamless end-to-end materials handling from wafer production to packaging and testing.
Technology-Led Growth and Proven Delivery Capabilities
YOUIBOT’s core competitiveness lies in three pillars:
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Technological Leadership – Featuring high-precision SLAM navigation, multi-sensor fusion, and its proprietary Fleet Management System for coordination of thousands of robots.
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Customization Capability – Tailored solutions to meet specific customer requirements across diverse semiconductor workflows.
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Project Execution Strength – In 2020, YOUIBOT won China’s first 100-unit wafer transport robot project, setting a new industry benchmark.
With these advantages, YOUIBOT has seen explosive growth in 2024, with semiconductor robot orders surging and production now scheduled through November 2025—a testament to its market validation and delivery credibility.
Empowering Global Clients and Driving Industry Transformation
YOUIBOT’s solutions have been adopted by nearly 100 global semiconductor leaders, including TSMC, SMIC, and HT-Tech. At one top-tier international fab’s 8-inch wafer facility, over 50 OW8 robots were deployed for fully automated SMIF POD handling—eliminating manual transport and enhancing throughput in 24/7 production lines.
As China accelerates domestic innovation in semiconductors, YOUIBOT is doubling down on R&D and ecosystem integration. With intelligent, high-efficiency logistics systems at its core, the company aims to empower global clients and help propel China’s semiconductor industry from follower to global leader.
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